专利名称:ELECTRIC CIRCUIT ARRANGEMENT发明人:SCHAUZ, STEPHAN申请号:EP04797703.8申请日:20041108公开号:EP1688022A1公开日:20060809
摘要:The invention relates to an electric circuit arrangement (1) comprising aninterconnect device (2) that is equipped with a chip (3). Said interconnect device (2)contains a substrate (4), in which a receiving recess (5) is configured that is closed on allsides. First contact pads that are connected to printed conductors (6) are provided on thebase. Said pads are electrically connected to second contact pads (17) of the chip (3) thatis positioned above the first pads by the interposition of a contact element (24) that is ananisotropic electric conductor and simultaneously elastically deformable. A forceexertion structure that is fixed to the substrate (4) exerts a force on the upper face ofthe chip (3) to produce the contact pressure required for the establishment of electricalcontact.
申请人:FESTO AG & CO.
地址:Ruiter Strasse 82 73734 Esslingen DE
国籍:DE
代理机构:Vogler, Bernd
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