IPC650-2.5

SECTION 2.5-----ELECTRICAL TEST METHODS

Number 2.5.1.B 2.5.2.A 2.5.3.B 2.5.4 2.5.4.1.A 2.5.5.A 2.5.5.1.B Test Item Arc Resistance of Printed Wiring Materials Capacitance of Insulating Materials Current Breakdown, Plated Through Holes Current Carrying Capacity, Multilayer Printed Wring Conductor Temperature Rise Due to Current Changes in Conductors Dielectric Constant of Printed Wiring Materials Permittivity (Dielectric Constant) and Loss Tangent (Dissipation Factor) of Insulating Material at 100MHz (Contacting Electrode Systems) 2.5.5.2.A Dielectric Constant and Dissipation Factor of Printed Wiring Board Material--Clip Method 2.5.5.3.C Permittivity (Dielectric Constant) and Loss Tangent (Dissipation Factor) of Materials (Two Fluid Cell Method) 2.5.5.4 Dielectric Constant and Dissipation Factor of Printed Wiring Board Material--Micrometer Method 2.5.5.5.C Stripline Test for Permittivity and Loss Tangent (Dielectric Constant and Dissipation Factor) at X-Band 2.5.5.5.1 Stripline Test for Complex Relative Permittivity of Circuit Board Materials to 14 GHZ 2.5.5.6 Non-Destructive Full Sheet Resonance Test for Permittivity of Clad Laminates 2.5.5.7 Characteristic Impedance and Time Delay of Lines on Printed Boards by TDR 2.5.5.8 Low Frequency Dielectric Constant and Loss Tangent, Polymer Films 2.5.5.9 Permittivity and Loss Tangent, Parallel Plate, 1MHz to 1.5 GHz 2.5.6.B Dielectric Breakdown of Rigid Printed Wiring Material 2.5.6.1.A Dielectric Strength, Polymer Solder Mask and/or Conformal Coatings 2.5.6.2.A Electric Strength of Printed Wiring Material 2.5.6.3 Dielectric Breakdown Voltage and Dielectric Strength 2.5.7.C Dielectric Withstanding Voltage, PWB 2.5.8.A Dissipation Factor of Flexible Printed Wiring Material 2.5.10.A Insulation Resistance, Multilayer Printed Wiring (Between Layers) 2.5.10.1 Insulation Resistivity for Adhesive Interconnection Bonds 2.5.11 Insulation Resistance, Multilayer Printed Wiring (Within a Layer) 2.5.12 Interconnection Resistance, Multilayer Printed Wiring 2.5.13.A Resistance of Copper Foil 2.5.14.A Resistivity of Copper Foil 2.5.15.A Guidelines and Test Methods for RFI-EMI Shielding of Flat Cable 2.5.16.A Shorts, Internal on Multilayer Printed Wiring 2.5.17.E Volume Resistivity and Surface Resistance of Printed Wiring Materials 2.5.17.1.A Volume and Surface Resistivity of Dielectric Materials Date 5/86 7/75 8/97 4/73 8/97 7/75 5/86 12/87 12/87 10/85 3/98 3/98 5/ 11/92 7/95 11/98 5/86 2/88 8/97 10/86 8/97 7/75 12/87 11/98 4/73 4/73 3/76 8/76 10/86 11/88 5/98 12/94 2.5.17.2 Volume Resistivity of Conductive Resistance Used in High Dentisty 11/98 Interconnection (HDI) and Microvias, Two-Wire Method 2.5.18.B Characteristic Impedance Flat Cables (Unbalanced) 7/84 2.5.19.A Propagation Delay of Flat Cables Using Time Domain Reflectometer 7/84 2.5.19.1.A Propagation Delay of Flat Cables Using Time Domain Reflectometer 7/84 (TDR) 2.5.21.A Digital Unbalanced Crosstalk, Flat Cable 3/84 2.5.24 Conductor Resistance, Flexible Flat Cable 6/79 2.5.25.A Dielectric Withstand Voltage Flexible Fat Cable 11/85 2.5.26.A Insulation Resistance Flexible Flat Cable 11/85 2.5.27 Surface Insulation Resistance of Raw Printed Wiring Board Material 3/79 2.5.28.A Q Resonance, Flexible Printed Wiring Materials 4/88 2.5.30 Balanced and Unbalanced Cable Attenuation Measurements 12/87 2.5.31 Current Leakage (Through Overglaze Films) 12/87 2.5.32 Resistance Test, Plated Through-Holes 12/87 2.5.33 Measurement of Electrical Overstress from Soldering Hand Tools 11/98 2.5.33.1 Measurement of Electrical Overstress from Soldering Hand Tools (Ground 11/98 Measurements) 2.5.33.2 Measurement of Electrical Overstress from Soldering Hand Tools 11/98 (Transient Measurements) 2.5.33.3 Measurement of Electrical Overstress from Soldering Hand Tools (Current 11/98 Leakage Measurements) 2.5.33.4 Measurement of Electrical Overstress from Soldering Hand Tools (Shielded 11/98 Enclosure)