专利名称：Method of producing treated copper foil,
products thereof and electrolyte useful insuch method
发明人：Wolski, Adam M.,Maquet, Laurette M.,Streel,
Michel
申请号：EP92100538.5申请日：19920114公开号：EP0495468A2公开日：19920722
摘要：An improved treatment for copper foil comprising electrodepositing a metallicbarrier layer of copper, zinc and antimony on at least one side of the foil which,
preferably, has a matte surface formed prior to forming the barrier layer. The so-treatedfoil provides a high bonding strength when laminated to polymeric substrates and resistsundercutting by mineral acid etchants and rinses during production of printed circuitboards.
申请人：CIRCUIT FOIL U.S.A. INCORPORATED
地址：88 Route 130 Bordentown, New Jersey 08505-2297 US
国籍：US
代理机构：Grünecker, Kinkeldey, Stockmair & Schwanhäusser Anwaltssozietät
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