专利名称：Reactive fusible glue发明人：SCHENKEL, HUBERT, DR.申请号：EP89114490.9申请日：19890805公开号：EP0354498B1公开日：19991020
摘要：A reactive hot-melt adhesive is described, which contains a resin component, atleast one thermally activatable latent curing agent for the resin component and
optionally accelerators, fillers, thixotropic agents and further conventional additives. Theadhesive is characterized in that the resin component is obtainable by reacting a) anepoxy resin solid at room temperature and b) an epoxy resin liquid at room temperaturewith c) a linear polyoxypropylene having amino terminal groups, in which the epoxy resinsa) and b) are used in such a quantity, based on the polyoxypropylene with amino terminalgroups, that an excess of epoxy groups, based on the amino groups, is ensured.
申请人：HENKEL TEROSON GMBH,HENKEL TEROSON GMBH,HENKEL TEROSON GMBH
地址：DE
国籍：DE
代理机构：Mathes, Nikolaus, Dr.
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