专利名称：Chemical mechanical polishing a substrate
having a filler layer and a stop layer
发明人：Raymond R. Jin,Shijian Li,Fred C.
Redeker,Thomas H. Osterheld
申请号：US11075778申请日：20050308公开号：US07201636B2公开日：20070410
专利附图：
摘要：A substrate is chemical mechanical polished with a high-selectivity slurry untilthe stop layer is at least partially exposed, and then the substrate is polished with a low-
selectivity slurry until the stop layer is completely exposed.
申请人：Raymond R. Jin,Shijian Li,Fred C. Redeker,Thomas H. Osterheld
地址：San Jose CA US,San Jose CA US,Fremont CA US,Mountain View CA US
国籍：US,US,US,US
代理机构：Fish & Richardson
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