SPUTTERING DEVICE

专利名称：SPUTTERING DEVICE发明人：SHIODA TOMOSHIRO申请号：JP11955082申请日：19820709公开号：JPS6133076B2公开日：19860731

摘要：PURPOSE:To provide a titled device which prevents oxidation of a target,improves the quality of plating and permits efficient carrying in and out of a material tobe plated by the constitution wherein the target and anode are moved to anotherchamber and are shielded with a valve upon completion of a sputtering stage.

CONSTITUTION:A target 16 and an anode 19 mounted to a flange 11, an insulation ring13, an annular plate 14, etc. are pulled up into an auxiliary vessel 4 having a bellows 12 bya hydraulic type vertically movable mechanism 9a, etc. and the spacing between the sameand a body 3 of the vessel is shielded with a gate valve 20 upon completion of asputtering stage in a sputtering device which plates a thin sputtered film on the surfaceof an object P to be plated by using the anode 19 enclosing the cylindrical target 16 in avacuum vessel 2 fixed on a base 1. A cover body 5a or 5b is opened thereafter, and teobject P on a carriage Q is carried to the outside of the body 3 and the fresh object P iscarried by another carriage Q into said body.

申请人：TOKUDA SEISAKUSHO

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