SPUTTERING DEVICE

专利名称：SPUTTERING DEVICE发明人：UCHIYAMA, Naoki申请号：EP147767.5申请日：20140307公开号：EP2980269A1公开日：20160203

专利附图：

摘要：A sputtering device 1 includes: a vacuum chamber 2; a plurality of targets 8 (8ato 8d); a shield 9 that selectively exposes, to the inside of the vacuum chamber 2, only atarget 8c out of which a film is to be formed; a substrate holding unit 11 that holds asubstrate 10 on which fine particles ejected from the target 8c are deposited to form a

film; a first transfer unit 14 that fixedly holds and moves the substrate holding unit 11; amask 16 disposed between the substrate 10 and the target 8c; a second transfer unit 19that moves the mask 16; and a plurality of through-hole units 17a to 17f havingpatterned through holes 17 penetrating through the mask 16.

申请人：Atsumitec Co., Ltd.

地址：6-1, Takaokanishi 4-chome Naka-ku Hamamatsu-shi, Shizuoka 433-8118 JP

国籍：JP

代理机构：MERH-IP Matias Erny Reichl Hoffmann Patentanwälte PartG mbB

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