专利名称：Flip-chip connecting type semiconductor
device
发明人：Naohiko Hirano申请号：US08/582580申请日：19960103公开号：US058141A公开日：19980929
摘要：A plurality of bumps formed of low melting metal are disposed on the surfaceof the peripheral portion of a semiconductor substrate. Those bumps which are includedin the above bumps and formed on each corner portion of the semiconductor chip areconnected to a power supply wiring and a ground wiring used as a power supply wiring.The other bumps disposed in position other than the corner portions are connected to asignal wiring.
申请人：KABUSHIKI KAISHA TOSHIBA
代理机构：Finnegan, Henderson, Farabow, Garrett & Dunner, LP.
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