CERAMIC ELECTRONIC COMPONENT

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专利名称：CERAMIC ELECTRONIC COMPONENT发明人：Sung Jin PARK,Hyeog Soo SHIN申请号：US14478792申请日：20140905

公开号：US20150187487A1公开日：20150702

专利附图：

摘要：A ceramic electronic component may include: a chip body; external electrodeforming portions formed on both ends of the chip body in a length direction, on at leastone of an upper surface and a lower surface of the chip body, respectively; externalelectrodes formed on the external electrode forming portions, respectively; and a

protective layer formed between the external electrode forming portions and having athickness greater than that of the external electrodes.

申请人：SAMSUNG ELECTRO-MECHANICS CO., LTD.

地址：Suwon-Si KR

国籍：KR

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