Process for producing two interleaved patterns on

专利名称：Process for producing two interleaved

patterns on a substrate

发明人：Yves Morand,Thierry Poiroux申请号：US13187784申请日：20110721公开号：US08598038B2公开日：20131203

专利附图：

摘要：A process for producing two interleaved patterns on a substrate usesphotolithography and etching to produce, on the substrate, a first pattern of firstmaterial protruding regions separated by recessed regions. A non-conformal deposition

of a second material on the first pattern forms cavities in the recessed regions of the firstpattern. These cavities are opened and filled with a third material. The second material isthen removed, and the remaining third material forms a second pattern of third materialprotruding regions, wherein the second pattern is interleaved with the first pattern.

申请人：Yves Morand,Thierry Poiroux

地址：Grenoble FR,Voiron FR

国籍：FR,FR

代理机构：Gardere Wynne Sewell LLP

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