专利名称：Metallization forming method发明人：Seiichi Inoue,Akira Ichiki申请号：US12382239申请日：20090311公开号：US07866037B2公开日：20110111
专利附图：
摘要：A metallization forming method comprises the steps of: patterning a silverhalide emulsion on a surface of at least one side of a substrate in accordance with adesired metallization pattern to form a patterned emulsion layer; exposing thepatterned emulsion layer; and thereafter developing the exposed patterned emulsionlayer to form a patterned conductive silver layer having the metallization pattern.
申请人：Seiichi Inoue,Akira Ichiki
地址：Kanagawa JP,Kanagawa JP
国籍：JP,JP
代理机构：Akerman Senterfitt LLP
代理人：Joel C. Edwards, Esq.
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