专利名称:Lead frames for semiconductor device发明人:Aizawa, Yoshiaki, c/o Intellectual Property
Div.
申请号:EP90114692.8申请日:19900731公开号:EP0415106B1公开日:19970409
摘要:According to this invention, a semiconductor device includes a plurality of leadframes (11, 11) on which at least one semiconductor pellet (21, 21) is formed, a dummypellet (8) formed on at least one of the plurality of lead frames (11, 11), wires (31, 32) forconnecting electrodes (41, 42) of the semiconductor pellets (21) 22) with electrodes ofthe dummy pellet (8).
申请人:TOSHIBA KK
地址:JP
国籍:JP
代理机构:Lehn, Werner, Dipl.-Ing.
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