Copper etching solution

专利名称：Copper etching solution

发明人：希代 誠,渡口 繁,熊谷 博之,松原 敏明,中村 惟之申请号：JP2019529709申请日：20180709

公开号：JPWO2019013160A1公开日：20200521

专利附图：

摘要： An object of the present invention is to provide a copper etching solutioncapable of reliably suppressing galvanic corrosion, facilitating bath management, andhaving an excellent etching rate. In order to solve the above-mentioned subject, it is acopper etching liquid which consists of an alkaline aqueous solution, and is 1-70g / Lcopper, 25-% ammonia water conversion 10-500g / L ammonia water, and 5-500g / L.Ammonium salt of inorganic acid, ammonium salt of sulfonic acid, ammonium salt ofsaturated fatty acid, ammonium salt of aromatic carboxylic acid, ammonium salt ofhydroxy acid, ammonium salt of dicarboxylic acid. Provided is a copper etching solution,which is one or more ammonium salts selected from the group.

申请人：メルテックス株式会社

地址：東京都区日本橋本町四丁目８番２号

国籍：JP

代理人：吉村 勝博

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