Z3W301-RB-10资料

FERRITE CHIP BEADS1. PART NO. EXPRESSION :Z3 SERIESZ 3 W 1 2 1 - R C - 1 0(a)(b)(c)(d)(e)(f)(g)(a) Series code(b) Dimension code(c) Material code(d) Impedance code : 121 = 120ȍ(e) R : Reel(f) Current code : C = 300mA(g) 10 : Lead Free2. CONFIGURATION & DIMENSIONS :ADLGBCPCB PatternUnit:m/mABCDG1.00 Ref.H1.00 Ref.L3.00 Ref.2.00±0.201.25±0.200.85±0.200.50±0.303. SCHEMATIC :4. MATERIALS :baAg(100%)Ni(100%)-1.5um(min.)Sn(100%)-3.0um(min.)(a) Body : Ferrite(b) Termination : Ag/Ni/Sn5. GENERAL SPECIFICATION :a) Temp. rise : 30°C Max.b) Rated current : Base on temp. risec) Storage temp. : -55°C to +125°Cd) Operating temp. : -55°C to +125°Ce) Resistance to solder heat : 260°C.10secsNOTE : Specifications subject to change without notice. Please check our website for latest information.H03.07.2008SUPERWORLD ELECTRONICS (S) PTE LTDPG. 1元器件交易网www.cecb2b.com

FERRITE CHIP BEADS6. ELECTRICAL CHARACTERISTICS :EIASize08050805080508050805080508050805Impedance(ȍ )120 ±25%150 ±25%220 ±25%300 ±25%470 ±25%600 ±25%800 ±25%1000 ±25%TestFrequency( MHz )100100100100100100100100DC Resistance(ȍ )Max.0.150.200.300.350.400.450.550.65Z3 SERIESPart NumberZ3W121-RC-10Z3W151-RC-10Z3W221-RC-10Z3W301-RB-10Z3W471-RB-10Z3W601-RB-10Z3W801-RB-10Z3W102-RA-10Rated Current( mA )Max.300300250200200200150100Packaging : Paper Carrier Tape7. IMPEDANCE VS. FREQUENCY CURVES :Z3W121-RC-10Z3W121-RC-00FCM2012W-121T03300Z3W151-RC-10Z3W151-RC-00FCM2012W-151T03300250240IMPEDANCE(Ohm)200150IMPEDANCE(Ohm)180ZZ12010050XR110100100060X010R101001000FREQUENCY(MHz)FREQUENCY(MHz)Z3W221-RC-10Z3W221-RC-00FCM2012W-221T02400Z3W301-RB-10Z3W301-RB-00FCM2012W-301T02800IMPEDANCE(Ohm)ZIMPEDANCE(Ohm)300600200400Z100200X1001000X01R101001000R0110FREQUENCY(MHz)FREQUENCY(MHz)NOTE : Specifications subject to change without notice. Please check our website for latest information.03.07.2008SUPERWORLD ELECTRONICS (S) PTE LTDPG. 2元器件交易网www.cecb2b.com

FERRITE CHIP BEADS7. IMPEDANCE VS. FREQUENCY CURVES :Z3 SERIESZ3W471-RB-10Z3W471-RB-00FCM2012W-471T02800Z3W601-RB-10Z3W601-RB-00FCM2012W-601T021200IMPEDANCE(Ohm)Z400IMPEDANCE(Ohm)600800Z400200R0110X01001000R110X1001000FREQUENCY(MHz)FREQUENCY(MHz)Z3W801-RB-101Z3W801-RB-00FCM2012W-801T012001600Z3W102-RA-10Z3W102-RA-00FCM2012W-102T01IMPEDANCE(Ohm)IMPEDANCE(Ohm)800Z1200Z800400XR01101001000400XR01101001000FREQUENCY(MHz)FREQUENCY(MHz)NOTE : Specifications subject to change without notice. Please check our website for latest information.03.07.2008SUPERWORLD ELECTRONICS (S) PTE LTDPG. 3元器件交易网www.cecb2b.com

FERRITE CHIP BEADS8. RELIABILITY & TEST CONDITION :Z3 SERIESITEMElectrical Characteristics TestImpedanceDC ResistanceRated CurrentTemperature Rise TestPERFORMANCETEST CONDITIONHP4291A, HP4287A+16092ARefer to standard electrical characteristics listHP4338B1. Applied the allowed DC current.2. Temperature measured by digital surface thermometer.Preheat : 150°C, 60sec.Solder : Sn-Ag3.0-Cu0.5Solder Temperature : 260±5°CFlux for lead free : rosinDip Time : 10±0.5sec.30°C max. (ǻt)Solder Heat ResistanceAppearance : No significant abnormalityImpedance change : Within ±30%No mechanical damageRemaining terminal electrode : 70% min.PreheatingDipping260°CNaturalcooling150°C60seconds10±0.5secondsSolderabilityMore than 90% of the terminal electrode should be covered with solder.PreheatingDipping245°CNaturalcoolingPreheat : 150°C, 60sec.Solder : Sn-Ag3.0-Cu0.5Solder Temperature : 245±5°CFlux for lead free : rosinDip Time : 4±1sec.150°C60seconds4±1.0secondsTerminal StrengthThe terminal electrode & the dielectric mustnot be damaged by the forces applied on theright conditions.For Z Series :Size123456Force (Kfg)0.20.50.61.01.01.01.52.0> 25Time (sec)WW78Flexture StrengthThe terminal electrode & the dielectric mustnot be damaged by the forces applied on theright conditions.20(.787)Bending45(1.772)45(1.772)40(1.575)Solder a chip on a test substrate, bend the substrateby 2mm (0.079in) and return.100(3.937)NOTE : Specifications subject to change without notice. Please check our website for latest information.03.07.2008SUPERWORLD ELECTRONICS (S) PTE LTDPG. 4元器件交易网www.cecb2b.com

FERRITE CHIP BEADS8. RELIABILITY & TEST CONDITION :Z3 SERIESITEMBending StrengthPERFORMANCEThe ferrite should not be damaged by forcesapplied on the right condition.R0.5(0.02)1.0(0.039)TEST CONDITIONSeries nameZ2Z3Z4Z5Z6Z7Z8mm (inches)0.80 (0.033)1.40 (0.055)2.00 (0.079)2.70 (0.106)P-Kgf0.31.02.52.5ChipARandom Vibration TestAppearance : Cracking, shipping & any other defects harmful to the characteristics should not be allowed.Impedance : Within ±30%Drop 10 times on a concrete floor from aheight of 75cm.Appearance : No damage.Impedance : Within ±30% of initial value.Frequency : 10-55-10Hz for 1 min.Amplitude : 1.52mmDirections & times : X, Y, Z directions for 2 hours.A period of 2 hours in each of 3 mutually perpendiculardirections (Total 6 hours).a. No mechanical damageb. Impedance change : ±30%Temperature : 125±5°CApplied Current : rated currentDuration : 500±12hrsMeasured at room temperature after placing for 2 to 3hrs.Humidity : 90~95% RH.Temperature : 40±2°CDuration : 500±12hrsMeasured at room temperature after placing for 2 to 3hrs.DropLoading at HighTemperatureHumidityThermal ShockAppearance : No damage.Impedance : Within ±30% of initial value.Phase12Temperature (°C)-55±2°C+125±5°CTimes (min.)30±330±3For Z Series :Condition for 1 cycleStep1 : -55±2°C 30±3 min.Step2 : +125±5°C 30±3 min.Number of cycles : 5Measured at room temperature after placing for 2 to 3hrs.Temperature : -55±2°CDuration : 500±12hrsMeasured at room temperature after placing for 2 to 3hrs.Measured : 5 timesLow temperature storage testDropDrop 10 times on a concrete floor from aheight of 75cm.a. No mechanical damageb. Impedance change : ±30%Derating66A5A4A3A2A1.5A1ADerating CurveDerated Current(A)For the ferrite chip bead which withstanding current over 1.5A, as theoperating temperature over 85°C, the derating current information isnecessary to consider with. For the detail derating of current, pleaserefer to the Derated Current vs. Operating Temperature curve.321085125Operating Temperature(°C)Operating Temperature(¢XC)NOTE : Specifications subject to change without notice. Please check our website for latest information.03.07.2008SUPERWORLD ELECTRONICS (S) PTE LTDPG. 5元器件交易网www.cecb2b.com

FERRITE CHIP BEADS9. SOLDERING AND MOUNTING :9-1. Recommended PC Board Pattern3.001.00Z3 SERIES9-2. SolderingMildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses causedby the difference in coefficients of expansion between solder, chip and substrate. The terminations are suitable for allwave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hotair soldering tools.9-2.1 Lead Free Solder Re-flow :Recommended temperature profiles for re-flow soldering in Figure 1.9-2.2 Solder Wave :Wave soldering is perhaps the most rigorous of surface mount soldering processes due to the steep rise in temperatureseen by the circuit when immersed in the molten solder wave, typical at 230°C. Due to the risk of thermal damage toproducts, wave soldering of large size products is discouraged. Recommended temperature profile for wave soldering is shown in Fig. 29-2.3 Soldering Iron (Figure 3) :Products attachment with soldering iron is discouraged due to the inherent process control limitations. In the event thata soldering iron must be employed the following precautions are recommended.Note :d) 1.0mm tip diameter (max)a) Preheat circuit and products to 150°C.e) Use a 20 watt soldering iron with tip diameter of 1.0mmb) 350°C tip temperature (max)f) Limit soldering time to 3 secs.c) Never contact the ceramic with the iron tipPreheatingSoldering20~40sTP(260°C/10s max.)21720015060~180s280s max.60~150sTEMPERATURE °CTEMPERATURE °CNaturalcooling1.00PC board should be designed so that products are not sufficient under mechanical stress as warping the board.Products shall be positioned in the sideway direction againstthe mechanical stress to prevent failure.Preheating260245150SolderingNaturalcoolingTime(sec.)Figure 1. Re-flow SolderingOver 2min.GradualCoolingWithin 10sPreheatingSoldering3s(max.)10s(max.)TEMPERATURE °CNaturalcoolingFigure 2. Wave Soldering350330150Over 1min.GradualCoolingFigure 3. Hand SolderingNOTE : Specifications subject to change without notice. Please check our website for latest information.03.07.2008SUPERWORLD ELECTRONICS (S) PTE LTDPG. 6元器件交易网www.cecb2b.com

FERRITE CHIP BEADSZ3 SERIES9-3. Solder VolumeAccordingly increasing the solder volume, the mechanical stress to product is also increased. Exceeding solder volumemay cause the failure of mechanical or electrical performance. Solder shall be used not to be exceed as shown in Fig. 4.Upper limitRecommendabletFigure 4NOTE : Specifications subject to change without notice. Please check our website for latest information.03.07.2008SUPERWORLD ELECTRONICS (S) PTE LTDPG. 7元器件交易网www.cecb2b.com

FERRITE CHIP BEADS10. PACKAGING INFORMATION :10-1. Reel DimensionAZ3 SERIESType7\" x 8mmDBCA(mm)9.0±0.5B(mm)60.0±2.060.0±2.0C(mm)D(mm)13.5±0.5178.0±2.013.5±0.5178.0±2.07\" x 12mm13.5±0.52±0.513.5±0.5R10.57\" x 8mm7\" x 12mmR1.9R0.5120°10-2 Tape Dimension / 8mmMaterial : PaperP2:2±0.1E:1.75±0.1Po:4±0.1D:1.56+0.1-0.05tSeriesSize1Bo(mm)1.12±0.031.85±0.052.30±0.05Ao(mm)0.62±0.031.05±0.051.50±0.05Ko(mm)0.60±0.030.95±0.050.95±0.05P(mm)2.0±0.14.0±0.14.0±0.1t(mm)0.60±0.030.95±0.050.95±0.05D1(mm)nonenonenoneF:3.5±0.1W:8.0±0.1BoZ / L23(09)PAoKoMaterial : PlasticP2:2±0.05E:1.75±0.1Po:4±0.1D:1.5+0.1AW:8.0±0.1tSeriesSize23(09)Bo(mm)1.95±0.102.25±0.102.35±0.103.50±0.103.42±0.10Ao(mm)1.05±0.101.42±0.101.50±0.101.88±0.102.77±0.10Ko(mm)1.05±0.101.04±0.101.45±0.101.27±0.101.55±0.10P(mm)4.0±0.14.0±0.14.0±0.14.0±0.14.0±0.1t(mm)0.23±0.050.22±0.050.22±0.050.22±0.050.22±0.05D1(mm)none1.0±0.11.0±0.11.0±0.11.0±0.1F:3.5±0.05BoZ / L3(12)45PAD1:1±0.1AoKoSection A-A10-2.1 Tape Dimension / 12mmD:1.5+0.1E:1.75±0.1AW:12.0±0.1Po:4±0.1P2:2±0.05tSeriesSize6Bo(mm)4.95±0.14.95±0.16.10±0.1Ao(mm)1.93±0.13.66±0.15.40±0.1Ko(mm)1.93±0.11.85±0.12.00±0.1P(mm)4.0±0.18.0±0.18.0±0.1t(mm)0.24±0.050.24±0.050.30±0.05D1(mm)1.5±0.11.5±0.11.5±0.1F:5.5±0.05BoZ / L78AD1:1.5±0.1PAoKoSection A-ANOTE : Specifications subject to change without notice. Please check our website for latest information.03.07.2008SUPERWORLD ELECTRONICS (S) PTE LTDPG. 8元器件交易网www.cecb2b.com

FERRITE CHIP BEADSZ3 SERIES10-3. Packaging QuantityChip SizeChip / ReelInner BoxMiddle BoxCartonBulk (Bags)8100040002000040000700071000400020000400001200062000800040000800002000052500125006250012500030000430001500075000150000500003 (12)200010000500001000001000003 (09)40002000010000020000015000024000200001000002000002000001100005000025000050000030000010-4. Tearing Off ForceF165° to 180°Top cover tapeRoom Temp.(°C)5~35Room Humidity(%)45~85Room atm(hPa)860~1060Tearing Speed(mm/min)300The force for tearing off cover tape is 15 to 60 gramsin the arrow direction under the following conditions.Base tapeApplication Notice1. Storage Conditions :To maintain the solderabililty of terminal electrodes :a) Temperature and humidity conditions : -10 ~ 40°C and 30 ~ 70% RH.b) Recommended products should be used within 6 months from the time of delivery.c) The packaging material should be kept where no chlorine or sulfur exists in the air.2. Transportation :a) Products should be handled with care to avoid damage or contamination from perspiration and skin oils.b) The use of tweezers or vacuum pick up is strongly recommended for individual components.c) Bulk handling should ensure that abrasion and mechanical shock are minimized.NOTE : Specifications subject to change without notice. Please check our website for latest information.03.07.2008SUPERWORLD ELECTRONICS (S) PTE LTDPG. 9