Semiconductor power module and method of producing

专利名称：Semiconductor power module and method

of producing the module

发明人：Neidig, Arno, Dr. Dipl.-Phys.,Bayerer,

Reinhold, Dr. Dipl.-Ing.,Hahn, Bertold

申请号：EP87101303.3申请日：19870130公开号：EP0237739A2公开日：19870923

专利附图：

摘要：the feuchtedichten encapsulation of leistungshalbleitermodulen (14214313)with a plastic housing (18) and a metallisierter ceramics existing substrate (1101201) as

the soil, the invention proposes a framework within the housing (10110210310) fromceramics or met all order.for the manufacture of the module (14214314), an intermediate(17117217) manufactured with the framework (10110210310) close to the substrate(1101201) connected in a lower part with a soft vergu\ßmasse (15) poured out. theintermediate (17117217) is then in a housing (18) is used.finally, the interior of the module(14214314) with a hartvergu\ßmasse (23) poured out.

申请人：Asea Brown Boveri Aktiengesellschaft

地址：Kallstadter Strasse 1 D-68309 Mannheim DE

国籍：DE

代理机构：Rupprecht, Klaus, Dipl.-Ing.

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